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Copper Lock Series No Heat Solder, 10 mL Tube, Liquid, -60 to 300 deg F Melting Point

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ComStar 10-801 Copper Lock Series No Heat Solder, 10 mL Tube, Liquid, -60 to 300 deg F Melting Point

Item #: 10-801 by COMSTAR INTERNATIONAL INC

UPC #: 024924108017

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Features
  • Copper Lock is a no heat, fast bonding solder for copper and brass pipe and fittings
  • Permanent leakproof bond-rated up to 500 psi
  • Meets US military specifications
  • Good with all refrigerants
  • Bonds Instantly, water systems can be pressure test in 2 mins
  • A/C system, can be pressure tested in 25 mins
  • Can be dissembled at 400 deg F heat and then reapplied

Net Content

10 mL

Form

Liquid

Melting Point

-60 to 300 deg F

Specific Gravity

2

Applicable Materials

Brass Copper Yellow Metal

Nomenclature

10-801 COPPER LOCK 10ML

Container Type

Tube

Product Overview
SOLDER 10ML NO HEAT CU LOCK
Specifications:

Compositions: Polyglycol Dimethacrylate Saccharin Cumene Hydroperoxide

Fast, easy, permanent, fit in the copper pipe and within seconds a permanent leakproof seal will occur. Pressure may be applied after two minutes. Can withstand pressures up to 500 psi. Withstands temperatures from -60 to 300 deg F. Meets US Military specifications. Good with all refrigerants.